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Exhibit TPCA Show 2024 (25th Taiwan Printed Circuit Association)

Exibition

SYC 2024-03-04 18:13

Visit Info.

Exhibition Dates

Dates : October 23 (Wed.) - October 25 (Fri.), 2024

Times : 10:00-17:00 (Closing one hour early on the last day)

Venue

TaiNEX 1, TAIPEI
Address : No.1, Jingmao 2nd Rd., Nangang District, Taipei City 11568, Taiwan  Map

Organizer

 

Co-organizer

Topic

PCB Expo Taiwan

  1. PCB Manufacturing: manufacture of single-layer PCB, double-layer PCB, multi-layer PCB,HDI and more… .
  2. PCB Testing Equipment: AOI testing equipment, non-destructive testing equipment, measuring equipment and more… .
  3. PCB Raw Materials and Chemicals: copper clad laminate（CCL）, copper electroplating liquid, etching liquid and more… .
  4. PCB Dry and Wet Process Equipment: drilling machine, exposure unit, loader / unloader, electroplating line equipment and more… .

EAssembly Expo Taiwan

  1. SMT equipment, testing equipment, materials, chemicals, consumptives.
  2. SMT testing and inspection equipment, insert component assembly equipment and materials.
  3. Semiconductor production equipment and materials, FPD production equipment and materials and more… .

Green Tech Expo Taiwan

  1. Environmental Equipment and Material Manufacturing Industries.
  2. Environmental equipment manufacturing industry, environmental material manufacturing industry.
  3. Recycled Product Manufacturing Industries: recycled product manufacturing industry, Eco-friendly product manufacturing industry.
  4. Environmental Technology Service Industries: environmental technology consulting industry, environmental engineering industry, environmental management technology.
  5. Service industry, and other technology service industries.

Thermal Management Expo Taiwan

  1. Thermal-module-related : thermal modules, heat pipes, fans, vapor chambers, heat sinks, thermal interface materials（TIM）,thermal.
  2. Conductive substrate, thermoelectric coolers, thermal conductive powder, liquid cooling, micro motors, nanometer heat radiation coating, raw materials… .
  3. Thermal Measurement and Modeling: thermal-measurement-related equipment, thermal design and analysis software… .

Packaging Expo Taiwan

  1. Resin, Lead frame, Electronic conductive, gold wire / Bonding Wire, Auto Molding Equipment, Trim & Form Equipment, Package Sawing Equipment, Flip Chip, COFA.

Co-exhibition

 

Main Exhibits

 

Organizer